Laser Decapsulation
Radiant Laser Etch 2
Laser decapsulation is a highly precise and reliable solution for removing plastic encapsulant material from electronic devices. Utilizing a 20W, 1064 nm laser, the encapsulant is cleanly vaporized, minimizing the risk of damage or defect loss that can occur with traditional chemical decapsulation methods.
This technique is especially well suited for small, delicate, or uniquely shaped devices that are difficult to process chemically. In addition to improved control and repeatability, laser decapsulation significantly reduces reliance on chemical consumables, delivering both operational and environmental benefits.
Our advanced in‑line camera with integrated laser technology allows you to view and etch devices simultaneously, streamlining your workflow with ease.
Featuring an impressive 18× optical zoom, it delivers crystal‑clear imaging for devices ranging from as small as 1 mm up to 100 mm. Discover unmatched precision, flexibility, and efficiency with our cutting‑edge solution.
Introducing our advanced laser technology, designed to precisely remove encapsulants while fully protecting delicate bond wires made of gold, copper, silver, and aluminum. You can have complete confidence that your critical materials remain intact and unharmed throughout the process. Experience exceptional precision, reliability, and peace of mind with our cutting‑edge laser solution.
Laser decapsulation is a highly delicate process that demands exceptional precision and care.
To safeguard the sensitive circuitry on the die surface, we recommend retaining a thin layer of molding compound—approximately 100 microns—which can then be safely removed using a wet‑etch step.
This approach is commonly used as a pre‑decapsulation process, ensuring samples are optimally prepared for subsequent chemical or plasma decapsulation while minimizing risk and maximizing reliability.
Laser Decap Samples
The Laser Etch Slice
Experience the power of our green laser technology. With its ability to slice through thick heat sink, silicon, and various hard metals, you can trust that our laser is the perfect tool for your cutting needs
Capabilities
-Capable of decapsulating IC packages less than 1mm x 1mm
-Capable of decapuslating IC packages 10mm or thicker
-Capable of cutting IC packages
-Real-time video monitoring
-High Resolution Camera ≥ 2 Megapixels
-Camera optical zoom up to 18x
-Image saving
-Filtration System
-Compliant with class 10k cleanroom
-Equipped with HEPA filter with Extra Filter and carbon filter
-Fume extractor included
-Positionable exhaust inlet
-Integrated interface (e.g. power and sleep) or interlock with exhaust/filtration system
-Installation and Training
Optional
-Programmable motorized Z axis which is able to set into recipe