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Radiant Optronics
Radiant Laser Decapsulation.
Radiant Laser Etch 2


Capabilities
-Capable of decapsulating IC packages less than 1mm x 1mm
-Capable of decapuslating IC packages 10mm or thicker
-Capable of cutting IC packages
-Real-time video monitoring
-High Resolution Camera ≥ 2 Megapixels
-Camera optical zoom up to 18x
-Image saving
-Filtration System
-Compliant with class 10k cleanroom
-Equipped with HEPA filter with Extra Filter and carbon filter
-Fume extractor included
-Positionable exhaust inlet
-Integrated interface (e.g. power and sleep) or interlock with exhaust/filtration system
-Installation and Training
Optional
-Programmable motorized Z axis which is able to set into recipe
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