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Ultratec ASAP-1 IPS

ENABLING THE NEXT GENERATION OF FAILURE ANALYSIS

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ULTRA TEC's ASAP-1 Project has always aimed to provide user-friendly and sample-friendly tools. The ASAP-1® offers intuitive controls that have helped labs achieve quality results for analysis with Photon emission microscopes, laser/thermal stimulus microscopes, and FIB's.

  • 2nd Generation Unit (for 2024)

  • Accurately decaps, thins & polishes

  • die, package, wafer and board-level

  • 2 UHD Stage Cameras – front & side

  • Target Camera and overlay software options

  • Touchscreen with physical joystick & encoders

  • Full 100 x 100 mm Stage area

  • X, Y and Z axes all have deep sub-micron accuracy

Upgrade Modules

3D Curvature Correction

 

3D Curvature Correction, when used alone, or in conjunction with Thermal Relaxation provides a flatter, more planar, backside-thinned and polished die-optimized for SIL, Laser scan and other microscopy techniques.
ASAP-IPS offers unique features, including the ability to set Xand Y Axis Curvature Independently.
This suilts rectangular dice or where curvature and stree varies between axis. 
The Unique Autocurve feature sets surve parameters automatically for an 'unkown' part.

3D Thermal Relaxation

 

3D Thermal Relaxation Module (Patent Pending) enhances ASAP-1 IPS toolkit for improving the planarity of warped and curve packaged dice. Controlled heating emulates the thermal profile of a device in service and 'relaxes' the substrate, removing die warpage and curvature. Sample preparation is then carried out 'at temperature'. Thermal Relaxation is key to the successful, high yield, crack free preparation of many package types exhibiting die warpape. In situations of severe die stress, or where the substrates moves substantially during the removal process, further improvements may be seen by utilizing 3D curvature control simultaneously with Thermal. The Thermal stage also acts as a useful 'in situ' hot plate for the rapid melting and setting of hot melt waxes such as Crystal Wax.

Endpoint Detection

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In-System Materials Charaterization
The High Impedence / small Capacitance End-Point Detection Module (Patent Pending) allows the ASAP-1 IPS to quantify and act upon the capacitive and /or resistive difference in properties between electronic enhance decapsulation and same preparation process results, by removing the guesswork.

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