Ultratec ASAP-1 IPS

ENABLING THE NEXT GENERATION OF FAILURE ANALYSIS

Ever since the inception of the ASAP-1 Project, ULTRA TEC’s goal has been to offer both user-friendly and sample-friendly tools. The ASAP-1® analog systems offer elegant, intuitive controls which have enabled all labs to achieve quality results for subsequent analysis with Photon emission microscopes, laser/ thermal stimulus microscopes and FIB’s. The user-friendly intutive nature of the analog units has been carried forward, and expanded 

3D Curvature Correction

 

3D Curvature Correction, when used alone, or in conjunction with Thermal Relaxation provides a flatter, more planar, backside-thinned and polished die-optimized for SIL, Laser scan and other microscopy techniques.
ASAP-IPS offers unique features, including the ability to set Xand Y Axis Curvature Independently.
This suilts rectangular dice or where curvature and stree varies between axis. 
The Unique Autocurve feature sets surve parameters automatically for an 'unkown' part.

3D Thermal Relaxation

 

3D Thermal Relaxation Module (Patent Pending) enhances ASAP-1 IPS toolkit for improving the planarity of warped and curve packaged dice. Controlled heating emulates the thermal profile of a device in service and 'relaxes' the substrate, removing die warpage and curvature. Sample preparation is then carried out 'at temperature'. Thermal Relaxation is key to the successful, high yield, crack free preparation of many package types exhibiting die warpape. In situations of severe die stress, or where the substrates moves substantially during the removal process, further improvements may be seen by utilizing 3D curvature control simultaneously with Thermal. The Thermal stage also acts as a useful 'in situ' hot plate for the rapid melting and setting of hot melt waxes such as Crystal Wax.

Endpoint Detection

In-System Materials Charaterization
The High Impedence / small Capacitance End-Point Detection Module (Patent Pending) allows the ASAP-1 IPS to quantify and act upon the capacitive and /or resistive difference in properties between electronic enhance decapsulation and same preparation process results, by removing the guesswork.

Force Feedback

In-System Materials Charaterization
The High Impedence / small Capacitance End-Point Detection Module (Patent Pending) allows the ASAP-1 IPS to quantify and act upon the capacitive and /or resistive difference in properties between electronic enhance decapsulation and same preparation process results, by removing the guesswork.

PEEC Proximity Electronic End Point Characterization

PEEC is a new, patent pending, characterization module for ASAP-1 IPS digital sample preparation system.PEEC improves sample preparation techniques, particularly at extremely thin remaining silicon thickness (RST).

PEEC offers several plotting and mapping modes that work in parallel with the ASAP-1 IPS, with the main polishing system acting as the Control Unit.

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