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  • IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution

  • Adaptive 3D Mesh & Curve Mapping

  • Import Overlays – use X-RAY, C-SAM images to improve targeting

  • Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning

  • High-Def Digital Cameras — all native 4K (UHD)

  • Option for (up to) 32” Vision Monitor

  • Program by Touch, Mouse/Keyboard or REMOTELY


  • DIGITAL Selected Area Preparation System, 100-240V, 50/60Hz.

  • X-Y table,

  • tool spindle drive with deep sub-micron Z-resolution,

  • +5/-5 degree automated tilt-table,

  • touch-screen programming unit,

  • integrated real-time machine vision,

  • 10-inch touchscreen lcd monitor,

  • set of 2mm and 3mm tools,

  • Force Feedback module.

  • Mounting Position for optional 24" (min) Monitor.

  • 4K Cameras (Target & Process)



  • Curvature Correction 

Adds sample curvature definition – Suits decapsulation, thinning, and polishing of packaged dice showing warpage or non-flat conditions. Independent X & Y Axis Correction, AUTOCURVE Mode. Also adds Stage AUTOTILT function

  • Heat & Cool Thermal Relaxation and Stability Upgrade 

Adds thermal relaxation capability for warped die. Peltier-based heating plate with 1C accuracy. Hot Plate mode for convenient sample mount/demount. Includes stage, cable, two custom mounting plates with nylon retention screws -- as 6366.1 but adds Chiller unit and software to allow for faster cooling and overall enhanced system thermal stability


  • End-Point Module – 6368.1

High impedance / small capacitance based -- Hardware and Software Upgrade to add end-pointing for enhancement of decap and de-processing

  • Through-Silicon RST Measurement System – UT-F3

UT-F3 Thickness Reflectance Measurement System Offers single or multi-point non-contact measurement (1280-1340nm) of silicon and other semiconductor substrates – measures down to approx. 10 microns RST. Adds a third 4K (UHD) Camera mounted at the RST Position.

  •  Vis Extension – UT-VIS

    2nd “VIS” Spectrometer added to the F3 system (requires UT-F3) to allow for measurements down to 10nm RST


  •  Wax-In Plate

  •  XYBOVE Re-application Tool

  •  Flip-over Workholder

  •  ASAP-1 Standard Mounting Plate

  •  ASAP-1 Repeat Positioning Holders

  •  Particulate Vacuum Pump

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