PLT PTIS-2 Thermal Imaging System
The PITS‑2 Thermal Imaging System is a powerful failure‑analysis solution designed to accurately detect hotspots caused by short defects on device chips.
With the rapid growth of new energy vehicles, the adoption of SiC chips and IGBT modules has increased significantly, driving a greater need for advanced and reliable failure‑analysis tools.
Designed to meet these evolving demands, the PTIS‑2 thermal imaging system delivers enhanced diagnostic capability, including the ability to detect low‑current hotspots using our advanced lock‑in thermography.
This ensures precise, dependable analysis for today’s high‑performance power devices.
The probe station supports testing across a wide range of samples, including decapsulated devices, bare chips, and full wafers.
An integrated thermal stage ensures optimal conditions for high‑quality thermal imaging during testing.
With four IR lenses and an optical lens, the system enables automatic lens switching for maximum flexibility and ease of use.
Advanced lock‑in thermography technology allows reliable detection of low‑power hotspots and low‑resistance shorts, delivering precise and dependable failure analysis results.
Feature
• Live Thermal Image Observation
• Measure temperatures with 0.1°C accuracy
• Overlay Hot spot with Visible Light Image
• IR Lens with Max ~3.2 Microns spatial
resolution
• Observe current collapse
• Built-In DUT Bias Supply
Specifications
