-Fast, isotropic etching by radicals only
-No ions, no microwave radiation, no electrical fields in the area of the samples
-Very low thermal impact only by chemical reaction energy due to the effect of the radicals
-Very high removal efficiency (>200μm/h) including inorganic filler materals
-No attack on bonding wires made of e.g. Au, Al, Cu, Cu/Pd and Ag
-Only slight etching of chip passivation (high selectivity > 500:1)
-Short decapsulation times: typically 1-3 hours after laser ablation
-High environmental compliance due to nearly complete dissociation of greenhouse gases like CF4