FAILURE ANALYSIS


MultiProbe

Multiscan Atomic Force (AFP) combines the lowest noise electrical probing with atomic force microscopy, resulting in world's highest resolution probing tool.

The Atomic Force Probe (AFP) is an ideal tool for imaging and contacting deep submicron structures. The sharp probes, nano-positioning using piezo electrics, and force feedback provide the user with a nanometer resolution map of surface structures and the ability to place the probes on the desired nodes very quickly with controlled contact force. The AFP is designed to use ultra-sharp tungsten needles to give the probes a tremendously long lifetime for both imaging and probing.

The Multiprobe AFP's real value is the ability to extract propertises at every possible stage of the process from silicide to final metalization. What once took a weeks worth of additional process steps is shortened to the time it takes to pull a wafer at contact or silicide level. How valuable would it be to measure propertises one month, one week or even one day sooner.
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Trion Technology

Phantom III Reactive Ion Etch (RIE) System

The Phantom III RIE is designed for etching nitrides, oxides and any films or substrates requiring fluorine-based chemistries. It's modular design, mounted on a space-saving platform, is the system of choice for many users throughout the world.



Sirus T2 Table Top Reactive Ion Etch (RIE) System

The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
Suss MicroTec
  • Liquid Crystal Probe Station


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    Left Coast Instruments

  • EliteEtch Automated Dual Acid Decapsulator
    • For more info on Elite Etch (PDF)


    New Wave Research Flat Panel Display Repair
  • QuikLaze 50ST2
  • EzLaze 3
    •  Semicon Failure Analysis
  • QuikLaze 50ST2
  • EzLaze 3
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    Nikon
  • Semiconductor Inspection Microscopes
  • Review Stations
  • Wafer Loaders




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    Wire Pull, Ball Shear, Die Shear and Ball Pull tester

    The FA1800 is the latest Failure Analysis tool, for evaluating the shear and wire pull strength of materials and bonding methods associated with semiconductor dies, ball and surface mounted passive elements.

    FA1800 Failure Analysis tool, capable for whole range of tests like wire Pull, Ball Shear, Die Shear and Ball Pull tester, it is a 4 in 1 tester.

    The FA1800 offers improved features such as :

    • User-friendly control : Joystick, X, Y & Z tables motion, max 100mm
    • Improved accuracy with zero backlash
    • Pre-positioning check vacuum hold down (Vacuum work holder)
    • Simplified operation manual
    • Modular software
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    Contact us for more information on Failure Analysis products